Through TSMC's IP Alliance Partner program Tensilica has validated the Xtensa processor in silicon. This ensures the best possible design experience, easiest design reuse and fastest integration into the overall system design. Tensilica continues to work closely with TSMC to target next generation process technologies.

Through Tensilica's partnership with Global Unichip, hardened versions of the Diamond processor cores are available for manufacturing at TSMC. See press release.