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Peripherals and on-chip buses provide the critical link between the
processor and the rest of the chip and system. Tensilica’s partners
provide solutions that will accelerate the development process by promoting
design reuse with existing buses, peripherals and software.
Tensilica is a member of OCP International Partnership (OCP-IP), a non-profit
semiconductor industry consortium formed to administer the support, promotion
and enhancement of the Open Core Protocol (OCP) specification. OCP is
the only fully supported, openly licensed, complete interface socket
for intellectual property (IP) cores. OCP addresses design, verification
and testing issues common to IP core reuse in "plug-and-play" system-on-chip
(SOC) products. Additional information is available at www.ocpip.org
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