S2C
Tensilica has a SOC prototyping partnership with S2C Inc., a leading provider of innovative FPGA-based ESL (electronic system level) and SoC prototyping solutions with a rapidly growing presence in the China market. S2C has already deployed Tensilica’s Diamond Standard 108Mini processor core into its TAI Logic Module FPGA-based ESL platform, and is working on a reference design and demonstration platform for Tensilica’s popular Diamond Standard 330HiFi Audio core.
“Amid increasingly shorter and more intense product design cycles in China, we are committed to providing integrated SoC design solutions that accelerate our customers’ product time-to-market,” said Toshio Nakama, CEO of S2C. “By partnering with Tensilica, we are able offer the widest, most comprehensive range of out-of-the-box processor cores on FPGA platforms for customers to integrate in their SoC designs. Our customers can thus stay ahead of the design curve and reduce the time taken by several key steps in the design process.”
S2C’s FPGA-based ESL solutions let designers easily and securely access IP in FPGA-based formats to quickly assemble SoC prototypes and start software development immediately. S2C’s core products comprise TAI Pod, a hardware module that links FPGA prototypes to PC through a USB2.0 interface; TAI Player, a software application that automates compile flow and interfaces to TAI Pod for runtime, debugging, and security functions; and TAI Logic Module, a scalable and cost-effective FPGA prototyping module. Collectively, these products have been proven to eliminate three to six months from S2C customers’ design cycles.
Based in San Jose, California and with offices in Beijing and Shanghai, China, S2C Inc. develops and produces advanced FPGA-based ESL and SoC prototyping solutions that accelerate and simplify the integration of embedded systems into chips. For additional information, please visit www.s2cinc.com.
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