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Press Releases 2007

December 18, 2007
Tensilica Adds Dolby Digital Consumer Encoder and Dolby Digital Compatible Output 5.1-Channel Encoders to Xtensa HiFi 2 Audio Engine Codec Library
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December 10, 2007
Tensilica Enhances Xtensa Configurable Processor Families with New Options, Bridges and Software Tools
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December 10, 2007
Tensilica Offers Integrated Real-Time Trace Support to Xtensa Configurable and Diamond Standard Processor Cores
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December 3, 2007
NEC Electronics America Offers Free License for Tensilica's Diamond Standard 106Micro Processor Core for Web Seminar Participants in the Americas
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December 3, 2007
Express Logic Introduces ThreadX RTOS Support for Tensilica's New Diamond Standard 106Micro
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November 28, 2007
DS2 Licenses Tensilica's Xtensa Processor for 200 Mbps Powlerline Chipset
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November 26, 2007
eASIC and Tensilica Partnership Delivers Free Diamond Processors on Free Mask Charge ASIC
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November 20, 2007
CoWare and Tensilica Integrate Diamond Standard 106Micro with CoWare ESL 2.0 Technology
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November 13, 2007
DTS Audio Technologies for Blu-ray Disc and HD DVD to be Added to Tensilica's HiFi 2 Audio Engine
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November 5, 2007
Tensilica Unveils Diamond Standard 106Micro Processor; Smallest Licensable 32-bit Core
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November 5, 2007
Tensilica Enhances Entire Diamond Standard Processor Core Family, Offers New Features and Memory Power Reductions Up to 30 Percent
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October 31, 2007
Valens Semiconductor Picks Tensilica's Diamond Standard 108Mini For Chip that Ensures High-Quality Home Audio-Video Networking
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October 16, 2007
Tensilica Ports MPEG-4 BSAC Decoder for Digital Multimedia Broadcasting (DMB) to HiFi 2 Audio Engine
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October 15, 2007
MediaPhy Licenses Tensilica's Diamond Standard 108Mini Processor Core
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September 18, 2007
Tensilica Picks EVE's ZeBu for Validation of Diamond Video Core
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September 17, 2007
Tensilica Joins Chip Estimate's Prime IP Partner Program
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September 10, 2007
P-Product Joins Tensilica's Partner Network:
Ports Codecs to the HiFi 2 Audio Engine
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September 4, 2007
Tensilica and Tallika Announce Secure SOC FPGA Platform
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August 28, 2007
hd Lab Becomes Tensilica Authorized Design Center
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August 28, 2007
IBEX Becomes Tensilica Authorized Design Center
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August 20, 2007
SiBEAM, Inc. Selects Tensilica Configurable Processor for Baseband DSP in Wireless Link for HDTV Devices
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August 7, 2007
Stonestreet One Joins As Tensilica Configurable Processor Design Center
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August 1, 2007
Tata Elxsi Becomes Tensilica's First Authorized Multimedia Processor Design Center
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June 19, 2007
Tensilica Enhances Reference Flow With Cadence Encounter RTL Compiler
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June 19, 2007
Aftek Becomes Tensilica Configurable Processor Authorized Design Center
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June 14, 2007
DesignArt Networks Picks Tensilica Xtensa LX2 Configurable Processors for WiMAX Baseband Chip
>Read More

June 6, 2007
Two Korean Universities License Tensilica’s Xtensa Configurable Processor
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May 16, 2007
Tensilica Announces Industry’s First MP3 Decoder Under 6 MHz
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May 8, 2007
SRS Labs Ports TruSurround HD to Tensilica’s HiFi 2 Audio Engine for HDTV SOC Designs
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May 2, 2007
Commetrex and Tensilica Announce Commetrex Fax Solutions for Tensilica’s Processor Cores
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May 1, 2007
Tensilica Offers Dolby Digital Plus 7.1-Channel Decoder for HD DVD Players, Blu-ray Disc Players, and Set-Top Boxes
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April 17, 2007
Tensilica Adds Support for Low-Cost, Hardware-Based Simulations of Diamond Standard Processors
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April 3, 2007
CMC Microsystems Provides Hundreds of Canadian University Researchers with Access to Tensilica Prototyping Technology for Designs Using Xtensa LX2 Configurable Processors
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March 27, 2007
ByteTools’ Low-Cost Catapult Probe Supports Tensilica’s Processors
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March 12, 2007
Tallika Becomes Tensilica Configurable Processor Authorized Design Center
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March 6, 2007
Enuclia Picks Tensilica’s HiFi 2 Audio Engine For Flat Panel TV Chips
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March 5, 2007
Stretch Selects Tensilica Xtensa LX Processor and HiFi 2 Audio Engine to Power Second Generation S6000 Software Configurable Processor
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February 26, 2007
Tensilica’s New Energy Estimator Tool Guides Designers to Energy-Efficient SOC Architectures
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February 13, 2007
Penstar Technology Licenses Tensilica’s Diamond Standard 330HiFi Audio Processor Core for AVS Standard in China
>Read More

February 12, 2007
Plato Networks Adopts Tensilica’s Diamond Standard 108Mini For Upcoming 10Gigabit PHY Design
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February 7, 2007
Tensilica to Showcase Mobile Phones Featuring Its Audio and Video Processors at 3GSM in Barcelona
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February 6, 2007
AM3D’s 3D Mobile Handset Audio Now Available for Tensilica’s HiFi 2 Audio Engine
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February 5, 2007
LG Electronics Licenses Tensilica’s Diamond Standard 330HiFi
For High Quality Audio in Mobile TV Chipset
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February 5, 2007
S2C Becomes Newest Tensilica Prototyping Partner in China
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February 1, 2007
Tensilica Licenses Xtensa LX2 Configurable Processor to Marvell
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January 31, 2007
Tensilica Adds G.729AB Speech Codec for Its Popular HiFi 2 Audio Engine
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January 30, 2007
Epson Announces Long-Term Strategic Relationship with Tensilica for New REALOID Printer Engine Chip With Multiple Tensilica Configurable Processors and Future REALOID Designs
>Read More

January 30, 2007
Sony Renews and Updates License for Tensilica’s Xtensa LX2 Configurable Processor
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January 23, 2007
CoWare and Tensilica Deliver Breakthrough ESL Design Environment for Tensilica-based Platforms
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January 22, 2007
Tensilica Introduces TurboXim Fast Functional Simulator 40-80x Faster than ISS, Automatic SystemC Model Generation
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January 18, 2007
Virage Logic and Tensilica Team to Deliver Technical Webinar on Core-Optimized IP Kits for Accelerated Silicon Success
>Read More

January 9, 2007
Tensilica’s Diamond Standard Processors Receive Prestigious Portable Design Editor's Choice Award
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SOC book
RECOGNITION
Red herring top 100
Portable Design 2006 Editor's  Choice Award
Best Processor Cores of 2004
EDN's Hot 100 Products of 2006
QUOTABLE

“It is faster and easier to design complex SOCs using Xtensa configurable processors - especially when using the XPRES Compiler - than to hand-code complex SOC design elements in hardware using traditional RTL methods. Plus the Xtensa processors are programmable, so it will be valuable for future products and applications.”

- Katsuhiko Nishizawa, general manager of the IJP Design Department of the Imaging Products Operations Division of Seiko Epson Corporation.