Press Releases

Tensilica and VWorks are providing virtual platforms based on Tensilica's DPUs, dramatically reducing embedded software development time.

Now all products that include the HiFi Audio DSPs can be used to support the standard approved by the People’s Republic of China as the National Audio Standard (GB/T 22726-2008) for multi-channel audio decoding. Tensilica has delivered the HiFi DRA decoder to a number of Tier 1 system OEMs and semiconductor companies.

Tensilica’s customers have shipped over 300 million of its audio/voice DSP cores for use in digital televisions, smartphones, Blu-ray Disc players, automotive, audio/video receivers, portable digital radio and other consumer electronics equipment. Tensilica and its network of 30 plus partners have ported and optimized over 100 audio/voice encoders and decoders, audio enhancement software and pre-processing packages.

Tensilica has moved its research and development center in Pune, India, to a new building, doubling the space previously available. Tensilica plans to increase headcount by at least 50 percent in the next year.

Hiroyuki Uchimura has been promoted to managing director of its Japan office, Tensilica K.K. Mr. Uchimura replaces Masumi Takahashi, who is retiring but staying with Tensilica on a consulting basis.

Renesas will use the ConnX BBE16 DSP IP core for digital broadcasting receivers.

ClariPhy Communications, Inc., a leading developer of ultra-high speed mixed signal, digital signal processing (MXSP) SOC solutions for coherent optical networks, has licensed Tensilica’s Xtensa® dataplane processor unit (DPU) for a deeply embedded control application.

The second-generation multi-mode LTE/HSPA/3G baseband chip design announced last week by NTT DOCOMO features multiple Tensilica dataplane processors DPUs, including the HiFi Audio DSP and the ConnX BBE16 Baseband DSP. As with the first generation NTT DOCOMO-sponsored design now shipping in volume in cell phones and tablets, this chip was co-developed by industry leaders Fujitsu, Panasonic and NEC.

Now designers of SOCs for mobile devices can enable stunning audio settings, including full 5.1-channel HD audio.

Arkamys digital audio software currently is being ported on Tensilica’s HiFi Audio DSPs.

Sensory’s TrulyHandsfree Voice Control is recognized as providing the most accurate speech activation, a real challenge in noisy environments. It allows users to deliver commands from as far as 20 feet away or in high noise conditions, making it an ideal solution for controlling devices while multitasking or in the car where users need to focus on driving.

Tensilica will demonstrate its leadership in mobile audio/voice and baseband hardware and software IP processor cores at stand #1F39 at the Mobile World Congress 2012 in Barcelona (February 27 – March 1, 2012). Tensilica’s DPU IP cores have recently been designed into leading-edge designs from infrastructure providers (for macrocell, picocell and femtocell basestations) as well as handset providers for audio, LTE radio, Bluetooth and other functions.

Tensilica is driving the transition to LTE-Advanced and has already secured lead customers for its new product – the ConnX BBE32UE DSP IP core for baseband SOC designs. Using the ConnX BBE32UE DSP core, coupled with Tensilica Baseband DPUs, a fully software programmable, flexible modem for LTE-Advanced user equipment category 7 PHY (Layer 1) can be realized in less than 200mW (28 nm HPL process). It can also support 2G, 3G, LTE and HSPA+ standards.

After conducting a technical evaluation, VIA determined that Tensilica’s DPUs provide over four times the performance of competing processors on key algorithms used to benchmark competitive alternatives.

The companies will showcase a mutually developed demonstration of a low power, high-performance LTE User Equipment and eNodeB PHY with real-time downlink and uplink traffic at the upcoming Mobile World Congress 2012 event.

Acoustic Technologies’ SoundClear Mobile Voice 2-mic noise elimination and echo cancellation software has been ported to Tensilica’s HiFi Audio DSPs. It has already been implemented on Maxim Integrated Products’ Flexsound processor, which includes Tensilica technology, and is commercially available on Maxim’s MAX98095, a member of the company’s family of TINI CODECs developed for smartphones, tablets, laptops, and other audio and voice-enabled devices.

Sonics' advanced on-chip networks will support Tensilica’s processor interface (PIF) to maximize customers’ IP integration and SoC efficiencies.

“We picked Tensilica’s HiFi Audio because it has become the industry standard for audio DSP,” stated Dr. Jun Sun, president of HDIC. “HiFi Audio provides superior performance and smaller size/power and is proven in millions of products. Moreover, Tensilica has the most complete library with over 90 audio codecs readily available.”

NXP Semiconductors was the lead partner for Tensilica’s first ConnX Baseband Engine (BBE), announced on June 22, 2009. NXP Semiconductors, as the global leader for car entertainment systems, has successfully fabricated the ConnX Baseband Engine DSP in its automotive multi-standard software defined radio innovation platform, a highly flexible baseband processor for satellite and terrestrial digital radio and mobile HDTV (high-definition television) as well as car2X communication.

Quad 24- and 32-bit Architecture Enables Better Performance, Lower Power and Optimized Memory Footprint for High-Performance Algorithms

Dolby Volume enables designers of SOCs for home entertainment systems and digital televisions, and for handsets with mobile DTV, to provide viewers with a consistent playback volume level across all sources and content.

Tensilica will showcase innovations from customers that use the company’s dataplane processors (DPUs) in digital televisions (DTVs), Blu-ray Disc players, 4G handsets and data cards, and more at the 2012 Consumer Electronics Show. For this show, Tensilica has doubled its space in the meeting room area of the South Hall of the Las Vegas Convention Center and will be located at meeting room MP25166.