Valens Semiconductor Picks Tensilica's Diamond Standard 108Mini for chip that Ensures High-Quality Home Audio-Video Networking

 

SANTA CLARA, Calif. – October 31, 2007 – Tensilica, Inc. today announced that Valens Semiconductor, an Israeli start-up, has selected the Diamond Standard 108Mini as the controller for a SOC (system-on-chip) design that will enable high-quality transmission of audio and video in a home networking environment.

“We are designing a chip that will enable high quality transmission of audio and video in a home networking environment,” stated Dror Jerushalmi, CEO of Valens. “We picked the Diamond Standard 108Mini as our central controller based on the high quality Diamond Standard software tool environment, the low-power advantages of the Diamond 108Mini processor compared to conventional alternatives, and because the Diamond 108Mini core had the performance-headroom we needed.”

“We are excited to work with Valens Semiconductor, a highly innovative company, on next-generation consumer electronics,” stated Steve Roddy, Tensilica’s vice president of marketing. “Their project should lower the costs and simplify the installation of home networking, while bringing real consumer value.”

About Valens Semiconductor

Valens Semiconductor Ltd. is a fabless semiconductor company pioneering high definition audio and video transmission technology inside the home. The company is headquartered in Hod Hasharon, Israel.

About Tensilica

Tensilica, Inc. is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors in the market today – including full software tool-chain and modeling support - in both, an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica’s processor cores provides semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals. For more information on Tensilica’s patented, benchmark-proven processors, visit www.tensilica.com.

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Editors’ Notes:

• 
  Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
• Tensilica’s announced licensees include Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Berkeley Wireless Research Center, Broadcom, Brocade, Cisco Systems, CMC Microsystems, Conexant Systems, EE Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Hudson Soft, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, MedioPhy, NEC Laboratories America, NEC Corporation, NetEffect, Neterion, Nethra Imaging, Nippon Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd., Penstar, Plato Networks, PnpNetwork Technologies, SiBEAM, Silicon Optix, Sony, STMicroelectronics, Stretch, TranSwitch Corporation, u-Nav Microelectronics, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), and XM Radio.