Tensilica Joins Wi-Fi Alliance to Provide Wireless Multi-Standard Modem Solutions
Tensilica Offers Wide DSP Family Optimized for Low-Power Programmable Multi-Standard Modems
SANTA CLARA, Calif., USA – July 30, 2012 – Tensilica, Inc. today announced that it has joined the Wi-Fi Alliance, an industry consortium dedicated to driving adoption of Wi-Fi and device interoperability. Tensilica, already a leading IP supplier of multi-standard 3G/ LTE and LTE-Advanced modem cores and applications software, also has leading customers using the Tensilica dataplane processors (DPUs) for some of the older Wi-Fi standards. Now Tensilica plans to integrate Wi-Fi with its multi-standard radio capabilities. Several of Tensilica’s DPUs are ideal for Wi-Fi, including the popular ConnX D2 and the BBE DSP (digital signal processor) product family.
“We congratulate Tensilica on becoming a member of Wi-Fi Alliance,” said Edgar Figueroa, CEO of Wi-Fi Alliance. “By joining our organization, Tensilica has demonstrated its commitment to advancing Wi-Fi technology while preserving a great user experience.”
“We’re joining the Wi-Fi Alliance to help support the industry and provide the most power-efficient programmable solution for next-generation Wi-Fi chips,” stated Eric Dewannain, Tensilica’s vice president and business unit manager, Baseband Business Unit. “Our ConnX BBE 32 UE DSP is particularly well suited to provide the optimum balance of low power and high performance.”
The ConnX BBE 32 UE is part of the family of DSPs optimized for wireless communications. Tensilica’s DSPs range from the popular dual-MAC ConnX D2 to the 64-MAC ConnX BBE64 DSP, and they provide a wide range of performance for demanding communication standards including Wi-Fi, 2G, 3G, HSPA+, LTE and LTE-Advanced. All Tensilica DSPs are fully programmable in C and feature fully compatible top-end software tool sets and design environments in order to simplify software development.
The ConnX BBE32 UE DSP was specifically optimized for achieving the best power/performance/area in handsets for demanding communications standards such as LTE and LTE-Advanced. It has been optimized using 3G and LTE end-to-end reference implementations and validated in a full uplink/downlink platform including the demanding complex domain signal processing algorithms such as LTE channel estimation and MIMO (multiple input, multiple output).
Tensilica, Inc. is the leader in customizable dataplane processor IP cores with almost 200 core licensees. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to 100x the performance because they can be customized using Tensilica’s automated design tools to meet specific signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.
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