Tensilica’s ConnX Baseband Engine DSP Core Successfully Deployed by NXP Semiconductors
NXP to Also Use Tensilica's ConnX in Global Intelligent Traffic System Field Trials
Eindhoven, Netherlands, and Santa Clara, Calif. USA - January 16, 2012 - Tensilica, Inc. today announced that NXP Semiconductors N.V. (Nasdaq: NXPI) was the lead partner for Tensilica's first ConnX Baseband Engine (BBE), announced on June 22, 2009. NXP Semiconductors, as the global leader for car entertainment systems, has successfully fabricated the ConnX Baseband Engine DSP in its automotive multi-standard software defined radio innovation platform, a highly flexible baseband processor for satellite and terrestrial digital radio and mobile HDTV (high-definition television) as well as car2X communication. In the latter application, the processor is deployed in multiple Intelligent Traffic System Field Trials around the globe.
"Tensilica presented us with an intriguing application for their customizable dataplane processor technology, and we worked with Tensilica to evolve that into a product that worked very well for our requirements. We needed a DSP that went well beyond what else we could find on the market in terms of optimum power/performance/area," stated Andrew Turley, director of innovation for car entertainment, NXP. "NXP and Tensilica worked together to get a truly optimized solution that has the necessary DSP performance to tackle multi-standard next-generation digital radio applications in a small and power-efficient core."
"We are honored that NXP, as the market leader for car entertainment semiconductors has selected Tensilica as their DSP provider and was a lead partner for our ConnX BBE," stated Jack Guedj, Tensilica's president and CEO. "Our collaboration with NXP has helped us optimize our ConnX BBE and validates the benefits of Tensilica's customizable dataplane processors (DPUs) to build the most efficient digital signal processing engines for mobile wireless communications."
About NXP Semiconductors
NXP Semiconductors N.V. (Nasdaq: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. Headquartered in Europe, the company has approximately 28,000 employees working in more than 25 countries and posted sales of USD 3.8 billion in 2009. For more information, visit www.nxp.com
Forward-looking Statements / NXP Semiconductors
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Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
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- Tensilica's announced licensees include: Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD, Avision, Bay Microsystems, Brocade, Broadcom, Cavium, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Microelectronics, Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, Maxim, NEC Corporation, Nethra Imaging, Novatek, NuFront, NXP Semiconductors, Olympus Optical Co. Ltd., Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, SiBEAM, Sirius XM Radio ,Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), and Wolfson Microelectronics.