Tensilica Licensees Ship One Billionth IP Core, Projected to Reach Two Billion Cores in 2012
Santa Clara, Calif. USA - June 8, 2011 - Tensilica, Inc. today announced that it reached a milestone in May 2011 with the production of over one billion Tensilica DPUs (dataplane processor units). Tensilica's licensees are currently shipping at a run rate exceeding 500 million Tensilica DPUs per year, and Tensilica projects its customers will hit the two billion cumulative shipment mark by the end of 2012 - a doubling in volume in just 18 months.
"While I'm excited about hitting this important milestone, I'm even more excited about how bright our future looks," stated Jack Guedj, Tensilica's president and CEO. "We reached this milestone with virtually no unit shipments in LTE, where we have significant design wins that have yet to reach production."
The growth in unit shipments is a direct result of Tensilica's investments in standard cores for the high-volume mobile wireless and home entertainment markets combined with high-volume custom designs in the PC and video/imaging markets. DPUs from Tensilica combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. They are used for the signal processing-intensive tasks such as audio, video, and communications in SOC (system-on-chip) designs.
"Tensilica is at a point where the company could really take off," stated Will Strauss, president of Forward Concepts and leading DSP analyst. "It quickly jumped to a formidable position in baseband DSP IP cores for LTE and has the leading audio DSP core. And their customers really appreciate the ability to customize the cores for their exact applications."
"I want to thank our customers for their broad adoption of Tensilica products as well as all of the Tensilica employees, who have invested their hearts and minds into creating our leadership products and providing stellar support to our customers," stated Guedj.
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane processors combine the best capabilities of DSP and CPU while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
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- Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names are trademarks and/or registered trademarks of their respective owners.
- Tensilica's announced licensees include: Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD, Avision, Bay Microsystems, Brocade, Broadcom, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Semiconductor, Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, Maxim, NEC Corporation, Nethra Imaging, Novatek, NuFront, Olympus Optical Co. Ltd., Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, SiBEAM, Sirius XM Radio ,Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), and Wolfson Microelectronics.