Tensilica is already playing a pivotal role in next-generation LTE and 4G handset design. Several Xtensa LX DPUs are used in the latest LTE mobile handset SOC design by NTT DOCOMO and its partners NEC, Fujistu and Panasonic Mobile.See press release. Here is a picture of the LTE modem for Japan's LTE network:

Tensilica’s Hifi Audio and Xtensa processors are well accepted in wireless cellular handsets, tablets and portable media players. Because Tensilica’s processors are lower power, they are ideal for hand-held portable devices. Here are some of Tensilica’s customers that have developed chips for leading consumer wireless handsets:
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Pantech Ease |
Samsung Captivate
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Samsung Rubgy II
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Google Nexus One
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LG SH-400
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Sharp SH705ill
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Pantech Hush IM-S350
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The Blackberry Bold 9790 features Tensilica's HiFi audio for the best possible sound experience. It uses the Wolfson WM0010 chip. Working in tandem with the application processor, it combines Tensilica's low power audio co-processor with embedded system software, algorithms and software support, allowing manufacturers of smartphones, tablet PCs and televisions to integrate their own software components and build an individual HD audio solution that supports an extensive range of key use cases.
With audio increasingly being dis-integrated into separate audio devices, and audio processing demands growing, the WM0010 allows customers to differentiate their products in the market place.
Fujitsu's F-12C Smartphone is now available from NTT DOCOMO in Japan and features excellent sound quality with Tensilica's HiFi Audio DSP in the Wolfson WM0010 chip. The smartphone, is equipped with the latest Android(tm) OS 2.3 release and boasts a lightweight, compact body that fits comfortably in the palm of the user's hand. The F-12C's advanced audio technology enables a wide range of features that make the handset easier to hear, including "Super HAKKIRI VOICE (extra-clear voice) 3," which enhances the clarity of the caller's voice in noisy or crowded places, and "PITTARI VOICE (exact voice)," which adjusts the phone's audio to the proper volume based on the user's body movements when walking or running. As well, the smartphone is equipped with a voice balance feature that automatically accentuates the high-pitched portions of the sound of the other person's voice, making it easier to hear.
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Wolfson Microelectronics' WM0010 fully programmable high definition audio DSP is based on Tensilica's HiFi DSP core. See Wolfson's press release. It will be designed into smartphones, tablet PCs and televisions. |
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Atheros uses Tensilica in a number of high-volume, ultra-low power GPS, WiFi and Bluetooth design, including the AR30xx family of Bluetooth solutions and the AR6004 dual band (2.4 GHa, 6 GHz) and AR6005 single-band chips. |
ATI – “In our evaluation, we were very impressed with the suitability of Tensilica’s Xtensa processor for numerous functions in our complex SOC designs," stated Adrian Hartog, CTO, ATI (now AMD). “By adding functions in Xtensa processors, rather than hand coding them in RTL, we can make these functions programmable, giving us plenty of flexibility for changing standards and feature sets."
Tensilica processors are in ATI's Imageon Media Processors 2182, 2282, 2380 and 2388. Here are some of the mobile phones that ATI's chips are designed into.
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Cingular 8125
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Cingular 2125
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Cingular 8525
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LG PRADA
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Motorola KRZR
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Motorola RIZR
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Panasonic 705P
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Samsung SPH-V7800
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LG Electronics – LG Electronics (Korea) integrated the Xtensa processor into an SOC for the Korean government’s Digital Multimedia Broadcasting (DMB) standard and for the European DVB-H standard for television broadcast to mobile phones. Key applications include cellular phones for the local market as well as portable devices such as PDAs and digital televisions. Here are some of the LG phones with Xtensa inside:
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LT 1000
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LG-SB120
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LG-LB1500
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LD1200
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LG-LB1200
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LG-KB1500
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LG-KD1200
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LG-SV130
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LG-KB1300
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LG Electronics used AMD's Imageon 2282 in its sleek PRADA touch-screen phone.