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Press Releases

Apr 24, 2013
Cadence Reports First Quarter 2013 Financial Results and Completes Acquisition of Tensilica
Apr 16, 2013
ComplexIQ Partners with Tensilica for Multimedia over Coax (MoCA) Network Interface
Apr 9, 2013
Inomize Becomes Newest Tensilica Design Center in Israel
Mar 25, 2013
Algotochip Becomes Tensilica Design Center Partner
Mar 19, 2013
Tensilica Joins HSA Foundation to Help Establish Standards for Embedded Heterogeneous Computing
Mar 11, 2013
Cadence to Acquire Tensilica
Mar 4, 2013
MegaChips Completes Design Center Agreement with Tensilica to Enhance R&D and Expand Marketing Collaboration
Feb 27, 2013
AM3D Audio Enhancement Ported to Tensilica's HiFi Audio DSPs
Feb 25, 2013
Tensilica and Sensory Drive Industry’s Lowest Power DSP-Based Voice Activation Solution
Feb 25, 2013
Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products
Feb 21, 2013
SimpLight Achieves First LTE Modem Silicon Success Using Tensilica’s Complete ATLAS Reference Platform
Feb 21, 2013
Tensilica to Showcase Complete IP Solutions for Video, Imaging, Audio, Voice, DTV Demodulation and Baseband Communications at Mobile World Congress 2013
Feb 20, 2013
Tensilica to Demonstrate Fujitsu Smartphone that Uses Multiple Tensilica DPUs Including ConnX BBE DSP and HiFi Audio/Voice at Mobile World Congress in Barcelona
Feb 19, 2013
New mimoOn Library for Tensilica’s Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs
Feb 19, 2013
Sensory’s New TrulyHandsfree 3.0 Speaker Verification and Speaker Identification Optimized Port Available on Tensilica HiFi Audio/Voice DSPs
Feb 15, 2013
Bwave and Ubiso to Demonstrate World’s First Licensable Multi-Standard DVB-T2 DTV Demodulation IP Subsystem Based on Tensilica’s ConnX BBE16 DSP
Feb 14, 2013
NXP HD Voice Processing Smartphone Software Now Available for Tensilica’s HiFi Audio/Voice DSPs
Feb 13, 2013
Tensilica and Acoustic Technologies Extend Partnership to Deliver Complete Wideband HD Voice Processing Solution for Smartphones, Tablets and Other Mobile Computing Devices
Feb 12, 2013
Tensilica Unveils IVP – A New Imaging/Video DSP IP Core for Mobile Handsets, DTV, Automotive and Computer Vision Applications
Feb 12, 2013
Dream Chip and Tensilica Partner for Imaging/Video Development on the New IVP DSP
Feb 12, 2013
Almalence Ports Optimized Image Processing Software onto Tensilica’s New IVP Imaging/Video DSP
Feb 12, 2013
Irida Labs and Tensilica Partner for Computer Vision Applications on Tensilica’s New IVP Imaging/Video DSP
Feb 12, 2013
Morpho and Tensilica Partner for Image Processing Solutions for Mobile Devices
Feb 5, 2013
Phison Licenses Tensilica’s Dataplane Processor (DPU) for NAND Flash Memory Controllers and SSD Applications
Feb 4, 2013
TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process
Jan 7, 2013
Waves MaxxAudio Sound-Enhancement Technology Is Now Available for Tensilica HiFi Audio DSP Cores at CES
Jan 3, 2013
Tensilica Introduces the Smallest, Lowest Power DSP IP Core For Always-Listening Voice Trigger and Voice Recognition


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