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Listen to Chris Rowen's podcast about Tensilica at OnDesign Radio.
Founding
Tensilica was incorporated in July of
1997 by executives and technologists from the microprocessor,
software development tool, semiconductor and design
automation fields.
Mission
Tensilica’s mission is to provide new technologies that revolutionize system-on-chip (SOC) design, making it much faster and easier to design chips with the low power, programmability and data throughput needed for tomorrow’s demanding applications. Tensilica has become well known as the leader and major innovator in configurable processor technology, with multiple patents on its easy-to-use automated processor design systems. Tensilica’s processors are the engines of SOC design. Tensilica’s products include configurable and pre-configured standard microprocessor cores plus high-productivity development tools and a complete and totally integrated suite of software development tools. Tensilica solutions allow designers to create lower power, foundry-independent hardware and software specific to their applications. Tensilica technology leverages proven ASIC design methods, software programming models, and architectural standards to reduce risk and development time.
Financing
Major investors include Altera Corporation, Cisco
Systems, Conexant Systems, Foundation Capital,
Matsushita Electric Industries, Meritech Capital
Partners, NEC, Oak Investment Partners and Worldview
Technology Partners.
Products
Tensilica has two main product lines: the Diamond Standard processors and the configurable Xtensa processors.
Tensilica’s Diamond Standard processors are a set of ten off-the-shelf synthesizable cores that range from area-efficient, low-power controllers to audio and video processors and a high-performance DSP, all of which lead the industry in their respective categories both in lowest power and highest performance. The Diamond Standard processors are supported by an optimized set of Diamond Standard software tools and a wide range of industry infrastructure partners. They are available directly from Tensilica and through a growing list of ASIC and foundry partners.
Tensilica’s Xtensa processors are unlike other conventional embedded processor cores because they’re configurable, extensible and synthesizable. Using Xtensa technology, the system designer molds the processor to fit the application by selecting and configuring predefined elements of the architecture and by inventing completely new instructions and hardware execution units that can deliver performance levels orders of magnitude faster than alternative solutions. Designers use the Xtensa Xplorer™ Integrated Development Environment (IDE) to evaluate the effects of various configuration changes and new instructions on power, area and performance.
Once the designer determines the optimal configuration and extensions, the Xtensa Processor Generator automatically generates, in about an hour, a synthesizable hardware description complete with EDA scripts as well as a complete optimized software environment – including operating system support – matching each processor configuration. The power and flexibility of the configurable Xtensa processors make them the ideal choice for all complex SOC designs.
While Tensilica’s processors are ideal for standard control functions, they also can take on a much bigger load than conventional 32-bit RISC processors. Xtensa processors can be used to do the “heavy lifting” instead of blocks of RTL. Designers can configure and optimize the Xtensa processors for their exact applications in a fraction of the time that it takes to design and verify RTL. And the inherent programmability of the processor gives designers the flexibility to fix bugs and add features purely in software at any point - late in the design cycle or long after first shipment. This is impossible with hard-coded RTL.
Tensilica also offers the XPRES™ (Xtensa PRocessor Extension Synthesis) compiler, which automates the design of optimized configurable processors from standard C code. Designers input the original algorithm that they’re trying to optimize, written in standard ANSI C/C++, and the XPRES compiler, coupled with Tensilica’s automated processor generation technology, generates an RTL (register transfer level) hardware description and associated software tool chain. In less than an hour, the resulting hardware block is delivered in the form of a pre-verified Xtensa processor core, enabling customers to future proof their designs using the processor’s inherent programmability, and avoid the cost and risk associated with verifying custom logic. The generated RTL rivals the performance and efficiency of hand-coded RTL blocks through the use of concurrent operations, efficient data types, and optimized multiple wide, deep pipelines.
Target Applications
Tensilica solutions are optimized for embedded
applications such as set-top boxes, network protocol
processing, consumer electronics, wireless communications,
and audio and video processing. These are applications
where designers need high levels of performance,
coupled with low power and an optimized instruction
set. Tensilica’s products are ideal for a
broad range of applications because their attributes
can be tuned and extended to match the unique performance
and functionality requirements of applications. See our Customer Gallery for some of the recently introduced products that include Tensilica's processors.
Third Party Partners
Tensilica has established a comprehensive third
party partners program called the Tensilica Xtensions™ Network.
The Network brings together "best in class" products
and services from industry leaders to enable SOC
designers to accelerate development of their Xtensa-based
designs while meeting demanding performance and
time-to-market requirements. Tensilica Xtensions
Network partners provide resources and products
in the following areas:
Licensees
Tensilica’s growing number of licensing partnerships – over 130 licensees and 250+ designs proves that configurable processing is making its way into many areas of the embedded applications space including wireless communications, consumer devices and networking infrastructure equipment. Tensilica is engaged with the leaders in these markets. Publicly disclosed licensees include: Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Berkeley Wireless Research Center, Broadcom, Brocade, Chiplen, Cisco Systems, CMC Microsystems, Conexant Systems, DS2, EE Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Hudson Soft, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, MediaPhy, NEC Laboratories America, NEC Corporation, NetEffect, Neterion, Nethra Imaging, Nippon Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd., Penstar, Plato Networks, PnpNetwork Technologies, Samsung, SandForce, Server Engines, SiBEAM, Silicon Optix, Sony, STMicroelectronics, Stretch, TranSwitch Corporation, u-Nav Microelectronics, UpZide, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), WiLinx, and XM Radio.
Management
Jack Guedj, Ph.D. – President and Chief Executive Officer – Former President and CEO of Magnum Semiconductor, Vice President of Marketing and Sales for Cirrus Logic’s video products, President of Tvia, and Vice President of Worldwide Sales and Marketing at Faroudja.
Chris Rowen, Ph.D. – Chief Technology Officer – Founded Tensilica in 1997. Former VP and GM of Synopsys’ Design Reuse Group. Previously, VP for Microprocessor Development at MIPS Computer Systems.
Beatrice Fu – Senior Vice President of Engineering – Previously Director of the Microprocessor Software Lab at Intel and manager of logic design for the Intel 486.
Chris Carney – Chief Financial Officer – Formerly at Wind River and Ernst & Young. Member of the Institute of Chartered Accountants of England and Wales.
Ashish Dixit – Vice President
of Hardware Engineering – Formerly in engineering
positions with Silicon Graphics and Intel.
Steve Roddy – Vice President
of Marketing – Former VP of Sales and Marketing
for Amphion Semiconductor.
Board of Directors
Jerry Fiddler – Co-founder
of WindRiver Systems.
Harvey Jones – Chairman
and co-founder . Former CEO of Synopsys and Daisy
Systems.
Chris Rowen, Ph.D. – Founder and Chief Technology Officer, Tensilica Inc.
James Wei – General Partner,
Worldview Technology Partners.
Facilities
Research and development along with marketing, administration and customer support activities are based in the Company’s Santa Clara, California, headquarters location. Tensilica maintains additional offices across the United States as well as in Asia, Japan and Europe. Tensilica has recently established its subsidiary in India to carry out research and development in collaboration with R&D team in Santa Clara.
Trademarks
“Tensilica,” “Xtensa” and “Sea
of Processors” are registered trademarks,
and “Vectra,” “XPRES,” “Xtensions” and
the Tensilica logo are trademarks of Tensilica,
Inc.
Patents
Tensilica has applied for patent protection through
the filing of multiple U.S. and foreign patent
applications. In 2002, Tensilica was granted patents
on the company’s RISC processor architecture,
the language used to extend the processor’s
capabilities, and the fundamental concept of generating
application-specific processor hardware and software
together. In 2006 a challenge to one of Tensilica's patents was denied and additional patents were announced. See press release. See our Patents page.
Press/ Industry Analyst Information
Paula Jones
Director, Corporate Communications
Tel: 408 327-7343
Fax: 408 986 8919
Email: paula@tensilica.com
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